Sony today announced that it has developed a new next generation back-illuminated CMOS image sensor called stacked CMOS image sensor. This new image sensor layers the pixel section containing formations of back-illuminated structure pixels onto chips containing the circuit section for signal processing, which is in place of supporting substrates for conventional back-illuminated CMOS image sensors. According to Sony, this structure achieves further enhancement in image quality, superior functionalities and a more compact size that will lead to enhanced camera evolution.

Few of the main features of stacked CMOS image sensor:

• Large-scale signal processing circuits required for higher image quality and better functionality are built-in
• More compact image sensor chip size
• Even higher image quality of the pixel section by adopting manufacturing processes specialized for superior image quality
• Faster speeds and lower power consumption by adopting the leading process for the circuit section

Sony says the new image sensor is designed to meet increasing demands put on smartphone cameras and it offers higher pixel count, superior image quality and faster speeds. Sony has also developed new “RGBW Coding” function, which facilitates low noise, high quality image capture even in low light condition, and the proprietary “HDR (High Dynamic Range) Movie” function, which achieves brilliant color even when taking pictures against bright light.

Sony has succeeded in establishing a structure that layers the pixel section containing formations of back-illuminated structure pixels over the chip affixed with mounted circuits for signal processing, which is in place of supporting substrates used for conventional back-illuminated CMOS image sensors. By this stacked structure, large-scale circuits can now be mounted keeping small chip size. Furthermore, as the pixel section and circuit section are formed as independent chips, a manufacturing process can be adopted, enabling the pixel section to be specialized for higher image quality while the circuit section can be specialized for higher functionality, thus simultaneously achieving higher image quality, superior functionality and a more compact size. In addition, faster signal processing and lower power consumption can also be achieved through the use of leading process for the chip containing the circuits.

Sony has started sampling the new stacked CMOS image sensor and smartphones based on the new sensor would come to the market in second half of this year.