OmniVision today introduced new 8-megapixel sensor OV8850, the first CameraChip sensor built on a 1.1-micron OmniBSI-2 pixel architecture. The 1⁄4-inch OV8850 leads the CMOS sensor pixel design race in the smartphone market by enabling autofocus modules that are 20 percent slimmer than any 8-megapixel module in commercial use today. Besides a small footprint, the 1.1-micron OmniBSI-2 pixel offers significant improvements in power efficiency and image quality comparable to the previous generation 1.4-micron OmniBSI pixel, making it an attractive solution for next-generation smartphones and tablets.

“With our new OmniBSI-2 architecture, we have further miniaturized our pixels while delivering a 20 percent improvement in peak quantum efficiency in all color channels, a 35 percent improvement in low- light sensitivity and a 45 percent increase in full-well capacity in an extremely compact and power efficient package,” said Per Rosdahl, senior product manager at OmniVision. “This 1.1-micron OmniBSI- 2 pixel enables the next generation of miniaturization in mobile cameras, and is key to the high-resolution smartphone camera roadmap.”

The OV8850 fits in an 8.5 x 8.5mm autofocus camera module with a build height of 4.7 mm. Sampling will begin in August, with mass production expected in the first calendar quarter of 2012.