Intel started their Intel Developer Forum 2009 (IDF) on Tuesday in San Francisco. The theme of the conference is “The Continuum”. Intel describes continuum as same user experience across various devices ranging from servers to mobile handset. Intel CEO Paul Otellini said “We’re moving from personal computers to personal computing”, and combination of new technologies, platform architecture and software will allow us to build the continuum.

The biggest announcement at IDF was introduction of 22nm process technology. Paul showed world’s first 22nm SRAM wafer that had 364 Mbit array size, 2.9 billion transistors and 3rd generation high-k + metal gate transistors. Intel said that demonstrating working 22nm SRAMs is an important milestone towards building working 22nm microprocessors, as same transistor and interconnect features would be used on 22nm CPUs. Intel is on track to ship 22nm CPUs in second half of 2011.

Introduction of 22nm CPUs is two years away and hence the most exciting announcement for this year was 32nm processors. Intel has started production of 32nm Westmere based Clarkdale processors, which will ship in Q4 2009 and plans to ship 32nm mobile Arrandale processors in first quarter of 2010. Intel is also working on next generation Sandy Bridge architecture that will replace Nehalem. Sandy Bridge architecture will show up in desktop processors in second half of 2010.

Intel officially introduced first quad core Core i7 mobile processor at IDF. Intel is shipping three models of Core i7 mobile processors: Core i7-920XM with 2.0GHz speed, 3.2GHz Turbo and 8MB cache, Core i7-8200M with 1.73GHz speed, 3.06GHz Turbo and 8MB cache, and Core i7-7200M with 1.6GHz speed, 2.8GHz Turbo and 6MB cache. Intel didn’t mention price or availability, but many computer manufacturers have started taking orders for laptop based on the new processors. You can get more information about Core i7 mobile processor on Intel’s website.

Intel also for the first time did a live demo of Larrabee graphics chip at IDF. Intel will target the gaming market with the new graphics chip and the company expects to ship first commercial Larrabee graphics chip sometime next year. Intel demoed ray tracing technology of Larrabee that simulates the interaction of light with matter in a way that’s accurate and makes it really easy to get effects like light and shadows.

While we all are patiently waiting for USB 3.0, Intel showcased next generation Light Peak technology – an optical interconnect that runs at 10Gbps and can reach up to 100 Gbps. Light Peak can maintain those speeds over 100 meters and can transfer multiple singles at once. According to Intel, benefits of Light Peak are fewer and smaller connectors, longer and thinner cables, higher bandwidth and support for multiple I/O protocols on single cable.

On the software side Intel showed new Mobile v2.1 OS designed for smartphones. The redesigned OS features lot of widgets, panel based navigation and support for running multiple applications. The beta version of the OS is available now for testing. Intel also announced that BMW and Mercedes would use infotainment systems designed by Harman-Becker in 2012 that will be based on next generation Intel Atom processor made using 32nm processor technology.

Intel had many other Atom retailed announcements, but no new products were shown. Except, MIDs (mobile internet devices) running next generation Atom processors that will target handheld market. The new Atom processors will come to market in 2010. We have added a video below that shows all the new processor technologies that Intel announced at IDF 2009.