Submitted by lalit on May 21, 2012 - 8:11pm.
Pentax today announced the new weather and dust resistant digital SLR camera – the Pentax K-30. The camera features 81 seals set in its compact body and is built to be weather, dust and cold resistant, perfectly working at sub-freezing temperatures as low as 14°F (-10°C).
“No detail was overlooked when designing the dynamic new K-30 to be weather resistant,” explains John Carlson, Sr. Manager of Sales and Marketing, PENTAX. “Every seam, every button, every hinge has been weather sealed for adventure-proof creative photography. Whether enjoying outdoor activities such as hiking in the Rocky Mountains or on vacation cruising along on the Maid of the Mist at Niagara Falls, photographers can stop worrying about weather conditions and start focusing on capturing the perfect shot.”
Other features of the new camera are 16-megapixel APS-C sized CMOS sensor, PRIME M imaging engine, 1080p video recording at 30 fps, 11-point auto focus, 6fps continuous shooting mode, ISO range of 100 to 12800, 19 scene modes, shake reduction (SR) mechanism, 77 segment multi pattern metering system, 100% field view optical finder and 3-inch LCD monitor.
The new Pentax K-30 will be available in July 2012, priced $849.95 for body only and $899.95 for the kit including the DA L 18-55mm zoom lens.
Submitted by lalit on May 21, 2012 - 3:48pm.
Researchers at UCL have developed a new memory chip based on pure silicon oxide called ‘Resistive RAM’ (ReRAM) that can operate in ambient conditions without the need of vacuum, which was needed for chips based on titanium dioxide. Resistive RAM memory chips are based in oxides of metals, whose electrical resistance changes when a voltage is applied and these chips can maintain the state when the power is turned off. Phys.org posted the following about development of ReRAM chips:
Though researchers were able to store and extract data predictably from the new ReRAM chip, the actual manufacturing of the chip for mass use is still at least 5 years away. Researchers say that the silicon oxide chip can not only be used for memory storage, but also as a computer processor because of its unique resistance properties.
Submitted by lalit on May 20, 2012 - 10:04pm.
Sony has added the new NEX-F3 entry-level mirrorless camera to their highly successful Alpha NEX series. The NEX-F3 features the same excellent 16.1-megapixel Exmor APS HD CMOS sensor found on big brother NEX 5N. The camera also gets new features like a built-in flash and 180 degree tiltable LCD screen.
One of the new party tricks that NEX-F3 brings is the new Auto Portrait Framing feature for creating top-quality portraits quickly and easily. This feature identifies a subject’s position in a composed image, and follows the “rule of thirds” to trim the scene appropriately around the subject’s face, creating a beautifully composed portrait. The cropped portrait is then boosted to full resolution using Sony’s unique By Pixel Super Resolution technology, which uses pattern matching to maintain superb image detail, tones and textures in the photo. Both the original and cropped image files are saved for review.
By Pixel Super Resolution Technology is also used for the “Clear Image Zoom” feature, which digitally doubles the effective magnification of any lens attached to the camera. Ideal for travel and everyday shooting, it’s a great way to boost maximum focal length without carrying extra hardware.
Along with the new camera, Sony has also launched the new SEL18200LE E18-200mm F3.5-6.3 OSS LE telezoom lens that offers a powerful 11x zoom range. Smaller and 12% lighter than the SEL18200 lens, the new E-mount model features Optical SteadyShot to compensate for the effects of hand-shake. It also features Direct Manual Focus to give users precise control over focus settings, resulting in crisp, beautiful images.
The new NEX-F3 compact digital camera will be available this June in silver, black and white with an 18-55mm kit zoom lens (model SEL1855) for $600. The new SEL18200LE telezoom lens will be available this July in black for about $850. Check out the first look video posted by Sony for the new camera and the new lens.
Submitted by lalit on May 18, 2012 - 4:22pm.
Korea Economic Daily is reporting that Samsung has received 9 million pre-orders for the new Galaxy S III smartphone. The newspaper got this information from an unidentified Samsung official, who also said that Samsung is running their smartphone factory at its full capacity of 5 million units per month to meet the demand for the new handset.
However, we believe this 9 million preorders headline is bit misleading. Preorders normally mean orders from consumers directly before the launch of a product. But the 9 million number reported by Korea Economic Daily includes supply requested by over 200 carriers in more than 100 different countries for next 4-6 weeks not just for the launch. This means that carriers are stocking up the Galaxy S III for launch and first month or two of sales, rather than actually having 9 million preorders. [Via Reuters]
Submitted by lalit on May 18, 2012 - 12:18pm.
In the past few days many rumors about upcoming MacBook Pro have been posted by various website and our sources say that most of these rumors will come true. The MacBook Pro rumor mill started on Monday with a post by Mark Gurman on 9to5mac, in which he reported that next generation Pro will have ultra thin design, Retina Display and USB 3.0. After Mark’s post, many other tech websites also reported similar rumors about upcoming MacBook Pro. Below is a list of MacBook Pro rumors that will most probably come true and some additional tidbits from our sources:
Completely New Design: In March, we reported that Apple would not use wedge shape design for next generation MacBook Pro, as PC makers are shamelessly copying MacBook Air’s wedge design. And now 9to5mac also concurs with our old report. Gurman wrote on 9to5mac “The new 15-inch MacBook Pro is described as being an ultra-thin version of the current MacBook Pro. Basically, the prototype design is a thinner, yet more robust, version of the late-2008 design.” Our sources say that Apple will keep MacBook Pro and MacBook Air as two separate categories of Mac laptops with different designs.
Ivy Bridge Processors: It is a given fact that Apple will use the new quad-core Ivy Bridge processors in the new MacBook Pros. We have heard from a source that we should be ready for a surprise, as Apple is planning to use a quad core processor in higher-end 13-inch MacBook Pro model. With removal of optical drive Apple will have more space to design a better cooling system, which would allow them to use a quad core processor like new Core i7-3612QM that has 35W TDP.
NVIDIA 600M Series Graphics: Many reputable sources like Nilay Patel of The Verge and Joanna Stern of ABC News have already reported that MacBook Pro will use the new 28nm GeForce GT 650M graphics chip in place of AMD Radeon chip on current MacBook Pro model. However, our sources say that Apple isn’t just looking at one NVIDIA chip. They are planning to use at least two of the following graphics chips - GeForce GT 640M, GeForce GT 650M and GeForce GTX 660M. All the three graphics chips support display resolution up to 3840 x 2160, which will be required for the new Retina Display.
Solid State Drive: The latest rumor is that some of the MacBook Pro prototypes are using Samsung’s superfast 256GB 830 series SSD and the assumption is that Apple will use these SSDs across the line in various storage sizes. However, we have heard that new MacBook Pro will be going the iMac’s route, offering a combo drive that uses both NAND Flash storage and a traditional hard drive, as Apple knows that every Pro user needs more than 256GB storage. Apple might combine a MacBook Air like onboard Flash storage with a hard drive or can use a regular SSD with a hard drive. From what we have heard the best part of this setup will be that users won’t have to worry about where to store what files, the OS will take care of the process with users seeing just one drive.
USB 3.0: The new MacBook Pro will be the first Mac featuring USB 3.0. Genesys will supply USB 3.0 controller chip and also USB 3.0 card reader chip for the new Pro. The USB 3.0 is 4 times slower than Thunderbolt, but it’s slowly replacing the USB 2.0 and will be a great addition to the MacBook Pro that already offers superfast Thunderbolt port.
Retina Display: The headline feature of the new MacBook Pro will be Retina Display. Rumors are the 15-inch model will get a 2880 x 1800 resolution display and the 13-inch model will get a 2560 x 1600 resolution display. Many people are questioning the amount of visual improvement an ultra high-resolution display will bring on a laptop, because of the average viewing distance of more than 22-inches (1.5 to 2 feet). But if you have seen a 4K TV in action alongside a 1080p TV, you will know the difference. The image looks way sharper, colors look better and the video looks more real. You normally watch TV from 10-feet away and human eye can see more details the nearer it’s to the display. So, simply put, you will see the difference and it will be jaw dropping.
Submitted by lalit on May 15, 2012 - 10:48pm.
Lenovo today updated their complete ThinkPad Laptop lineup including X, T and L series with new Ivy Bridge processors, but the most interesting Laptop in the announcement was ThinkPad X1 Carbon Ultrabook. The X1 is the lightest 14-inch Ultrabook available, but as Lenovo points out it’s not light on performance, and features 3rd generation Intel Core i7 processor along with Solid State Drive (SSD) for almost instant responsiveness. Lenovo describes the laptop as:
“We crafted the ThinkPad X1 Carbon with premium carbon fiber material in order to make it incredibly thin and light, yet durable,” said Lu Yan, senior vice president, Think Product Group, Lenovo. “Our new ThinkPad laptop portfolio embodies much of the innovative thinking exemplified in the X1 Carbon, such as a backlit keyboard, super-bright high definition display, Dolby Home Theatre and rich communications features that balance business performance with personal use.”
Lenovo will start shipping the ThinkPad X1 carbon Ultrabook this summer. No word on price yet, but from the design and specifications we would say that it will be a premium product. You can get more information about the laptop on Lenovo’s website.
Submitted by lalit on May 15, 2012 - 7:12pm.
Sony today announced updates for VAIO E, VAIO S and VAIO Z series laptops. The E Series will get two new laptops with larger 15.5-inch and 17.3-inch screens. Both the laptops will have last generation Intel Core i5-2450M processor, AMD Radeon 7650M graphics, up to 750GB hard drive, built in webcam, USB 3.0, HDMI, Bluetooth and WiFi. The main difference between the two laptops is the screen, the 15.5-inch model has 1366 x 768 resolution screen and the 17.3-inch model has 1600 x 900 resolution screen (there is option of selecting Full HD screen also).
The new VAIO S Series now comes in 13.3-inch and 15.5-inch screen sizes, and is made out of materials like magnesium, aluminum and carbon fiber. The laptops feature new 3rd generation Intel Core i5 and i7m processors, NVIDIA GeForce GT640M LE graphics, anti-reflective VAIO Display Plus, slot-in optical drive (Blu-ray optional), up to 1TB hard drive, WiFi, Bluetooth, HDMI, USB 3.0 and optional 4G LTE/3G WWAN. Both the 13.3-inch and 15.5-inch models weigh less than 4.5 pounds and offer up to 14 hours battery life with optional sheet battery.
The Ultrathin and powerful VAIO Z Series also get Ivy bridge treatment with new Core i7 processor. The 0.7-inch thick laptop features 256GB SSD, 8GB RAM, AMD Radeon HD 7670M graphics, optional Power Media Dock with Optical drive, WiFi, Bluetooth, 3G/LTE support and USB 3.0. VAIO Z’s tough “hexashell” design is crafted with superlight carbon fiber and aluminum resulting in less than 2.6 pounds weight. And like the slightly heavier S Series the VAIO Z can also offer 14 hours battery life with optional sheet battery.
New VAIO E Series 15 and 17 is available in a choice of white, black or (E Series 15 only) silver color finishes for a starting price of $459, but if you go for slightly decent configuration the price will jump over $700. No word on when the new VAIO S and VAIO Z Series will ship or pricing.
Submitted by lalit on May 15, 2012 - 3:06pm.
AMD today announced its 2nd generation AMD A-Series Accelerated Processing Units (APU) for mainstream and ultrathin notebooks. The new APUs, codenamed “Trinity” have an improved design over previous generation and offer following new features:
AMD has launched the new A-Series with three APUs for mainstream laptops and two APUs for ultrathin laptops. On the mainstream side, following APUs are available:
On the Ultrathin side, AMD has the following two APUs:
Laptop based on new A-Series APUs from Acer, Asus, HP, Lenovo, Samsung, Sony and Toshiba are available beginning today with starting price as low as $649.
AnandTech, HotHardware, Hexus and PC Perspetive have posted reviews of the new A-Series APUs. And the reviews are very positive specially when is comes to integrated GPU performance. However, AMD still lags behind Intel when it comes to CPU performance. In fact, some reviewers have written that AMD’s new A-Series is still behind Intel’s last generation Sandy Bridge processors. Jarred Walton wrote on AnandTech:
Intel continues to offer better CPU performance, and if you need graphics—which mostly means you want to play games—they have a good partner with NVIDIA. AMD on the other hand is delivering better integrated graphics performance with less CPU power, and depending on what you want to do that might be a more well rounded approach to mobile computing.
Overall, AMD’s new A-Series Trinity APUs are a step in right direction and depending on your requirements can be a good option. Especially, if the prices of upcoming laptops based new APUs are right (rumors are prices will start as low as $649).
Apple to Use Thin-Film Touch Technology in 7.85-inch iPad, and Has Booked Half of Mobile DRAM Capacity at Elpida
Submitted by lalit on May 15, 2012 - 6:09am.
DigiTimes today published two Apple related rumors, both hinting at upcoming iOS devices. In the first rumors DigiTimes claimed that they have heard from reliable industry sources that Apple will use “G/F2” thin-film capacitive touch technology in upcoming 7.85-inch iPad. Siu Han posted:
The second rumor talked about Apple booking about 50% capacity at Elpida’s 12-inch fab in Hiroshima, Japan for production of mobile DRAM. Josephine Lien posted on DigiTimes:
This would indicate that not only Apple is expecting a big jump in DRAM memory use, but they are also expecting it soon. Rumors are that Apple will launch the next generation iPhone and 7.85-inch iPad before the end of Q3 2012. And they expect both these products to be big sellers.
Submitted by lalit on May 14, 2012 - 8:01pm.
Just few weeks back Intel started shipping Ivy Bridge processors based on 22nm process technology and Intel’s CEO Paul Otellini is already talking about 7nm and 5nm process technologies that are at least 3-5 generations away. In a presentation Otellini revealed that Intel has begun research on 7nm and 5nm manufacturing technology for processor. He said, “Our research and development is quite deep, I talk about ten years”.
Intel is looking into process lithography, materials for manufacturing and Interconnect technologies for 7nm and 5nm processors, as at such small size most of the current technologies won’t work without modifications or completely new materials.
Intel has already equipped D1X Oregon Fab, Fab 42 Arizona and Fab 24 Ireland for 14nm fabrication processes, which Intel will start in 2013. The company will follow 14nm processors with 10nm process technology in 2015. If Intel follows this time frame we should see 7nm processors in 2017-18 and 5nm processors in 2019-20. [Via Xbit Laboratories]
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