Intel at its Developer Forum in Shanghai announced details about its upcoming processor line-up, platforms and solid-state drives. Intel released details about it new Atom CPU line-up that is basically designed to use very less power and have very low Thermal Design Power (TDP). The first processor in the line-up Atom Z500 will have 800MHz clock speed, 400MHz FSB, 160mW Average power requirement, 0.65W TDP and will cost $45. This processor is aimed at mobile Internet devices with screen sizes of about 5-inch. The second Atom processor Z510 will have same FSB but increased clock speed (1100MHz), increased power requirement (220mW) and increased TDP (2W). The Z510 will be available for $45.  The Z520 and Z530 will have same FSB of 533MHz, same Power requirement of 220mW and same TDP of 2W, but will have 1333MHz and 1600MHz clock speed respectively. The Z520 will cost $65 and the Z530 will be priced for $95. The last processor on the list Z540 has the same FSB and power requirement as the Z530, but will have higher TDP of 2.4W, higher clock speed of 1860MHz and will cost $160. The last four Atom processors are aimed for UMPC and small form factor PCs like Eee PC. According to Intel the Atom processor will provide performance on par or higher than the Pentium M processor and will use less than 1/10 the power required by those processors. You should start seeing computer based on these processors by summer of 2008.

Intel also gave details about Moorestown architecture, the successor to Silverthorne architecture used in today’s Atom processors. The Moorestown will have a new processor (Lincroft), as well as a new system controller hub called Langwell. The Lincroft processor will add video hardware directly on the main processor resulting in improved visual performance and reducing the overall size of the complete package to less than the size of a US quarter. With the Moorestown, Intel will also release a unified wireless module know as Evans Peak. It will merge Bluetooth, GPS, WiFi and WiMax on a single chip. The smaller size will shrink the overall size of Mobile Internet Devices and micro notebooks.

Intel also demonstrated 3.2Ghz Quad-core processor based on Nehalem processor technology. The Nehalem technology is the successor to today’s Core architecture and is the fastest x86 chip. Intel has added Hyperthreading support allowing each of the four cores to run as many as two instruction threads at a time allowing it to handle work of eight cores. The Nehalem based processors will use QuickPath interconnect system that talks directly to each component resulting in faster data transfer between components. Nehalem will also have an on-die memory controller that will eliminate the need for a large Level 2 cache, with each core only having 256KB of Level 2 cache and a 8MB Level 3 cache. The processor based on Nehalem technology will ship in late 2008.

Intel previewed the Calpella notebook platform that will be successor to the company’s still unreleased Centrino-2 platform. The Calpella platform will use upcoming Nehalem processor based on 32nm technology. Calpella will use a revolutionary power management technology that will result in better battery life. Intel will also add new graphics engine that will improve overall visual experience. Calpella platform will be released in third quarter of 2009. Intel also revealed SSD drives that were previously codenamed “Rocket”. The drives will be available in 1.8” and 2.5” sizes, and in capacities ranging from 32GB to 160GB. According to Intel the drives will be twice as fast as present SSD drives. Each drive is ruggedized and tested against forces up to 1500G. The drives will be available in June and Intel has given no details about pricing.