The Taiwanese newspaper Economic Daily News is reporting that the United Microelectronics Corporation will be the foundry to produce Infineon Technologies PMB8878 3G baseband chip, which will be used in the new 3G iPhone. Previously it was reported that the beta firmware 2.0 for the iPhone mentions PMB8878 in the code. The 3G chips will be made using the more advanced 65nm process. The first generation iPhone used an Infineon baseband chip manufactured by Taiwan Semiconductor Manufacturing Company. The newspaper doesn’t provide a date for when production will start but supports the discovery of PMB8878 in Firmware code as the 3G chips iPhone will use.
[Via Electronista]